Abstract

This article enlightens the two-dimensional (2D) isotropic micro-polar thermoelastic problem of the three-phase-lag (3PHL) model and heat conduction equation is formulated in the context of memory-dependent derivative (MDD). The equations are converted into the domain of the Laplace transform vector matrix differential equation form and solved by using the eigenvalue technique. To obtain an analytical solution of displacement, temperature, and stress components Silicon material properties are used. Inversion of the Laplace transform with Fourier series expansion technique is used to obtain the numerical solution. For obtaining graphical results Mathematica software is used. For the purpose of exhibiting the beauty of MDD in the present model comparisons are made between the time delay parameters and kernel functions (constant, linear, and non-linear kernels), respectively, over the micro-polar panel. The results obtained have a valuable impact on structural analysis, especially in the design of rotating machinery structures using accurate material properties.

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