Abstract
With ever-rising heat dissipation in electronics, there has been considerable research into liquid-cooled systems. Intermittent spray cooling (ISC) is one of the novel and efficient ways to cool the IC chip. In this article, a sequential function specification method is applied to the experimentally measured data, to determine the transient heat transfer coefficient of the simulated chip cooled by an ISC process. The optimal number of future time steps for this problem is found. The sequential function specification method is also compared with a first-order regularization scheme. For the optimal regularization parameter, the model is reduced to be the same as the function specification method. Experiments were conducted for 2, 4 and 6 bar pressures at 11, 22 and 33 W cm−2. The trends of valve frequency, duty cycle and the calculated transient heat transfer are also discussed.
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