Abstract
Secondary ion mass spectrometry has been used to detect the migration of gold from the electrode into the oxide layer of Au-Y 2O 3-Y junctions during the electroforming process. The depth profiles obtained showed an increase of gold migration after the development of conductivity and again after the appearance of a voltage-controlled negative resistance when a forming voltage was applied. The results are discussed in terms of localized conduction at defects which are observed on the junction surface.
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