Abstract
PurposeTo provide a design guideline for an automotive electronic module in order to improve its reliability in elevated environmental environments as well as in vibration environments.Design/methodology/approachWire looping profiles, gel heights, and effects of mechanical vibration on aluminium wire bond failures are studied. Natural frequencies of various wire profiles are evaluated and effects of gel heights on reliability of products are studied using stochastic finite element analyses. The frequency dependent properties of silicone gels used in electronic modules are characterized by the corn and plate test. An experiment was also conducted in order to confirm numerical results.FindingsThe present study shows that the gel plays an important role in wire bond failures and reliability of the product. The gel reduces the amplitude of vibration of electronic modules due to its damping characteristics. However, both analytic and experimental results indicate that the gel imposes extra weight on the wires and may induce stresses on heels.Research limitations/implicationsIn the future study, it is suggested that other gel materials should be studied since the properties of gel strongly depend on the frequency which will affect the fatigue behavior of bonding wires.Practical implicationsThe findings can be used as general design guidelines for wire bonding for automotive electronic modules.Originality/valueThe results will be very useful to design bonding wires for automotive electronic modules.
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