Abstract
We developed a new wet-chemical method to grow the high-quality tunnel silicon oxide (SiOx) layer by using a strong-oxidizing mixed acid, which consists of three volumes of HNO3 (68 wt%) and one volume of H2SO4 (98 wt%), named as the CNS (concentrated nitric and sulfuric) acid for short. In comparison with the HNO3 acid, the CNS acid grows high-quality SiOx layer with the higher oxidized state at 60 °C, where the relatively low temperature avoids the significant volatilization of acid and remains the quality of acid during the extending process. The results prove that the SiOx grown in the CNS acid benefits for the surface passivation of the n-type polysilicon passivated contact structure. An average gain of implied open circuit voltage (iVoc) by 2–10 mV and a reduction of single-side surface saturated dark current (J0) by 1–7 fA/cm2 are obtained by using the 60 °C CNS-acid grown SiOx to replace the 60 °C HNO3-acid grown one. Also, in comparison with the 90 °C HNO3 acid, the 60 °C CNS acid exhibits improved stability and repeatability for preparing the SiOx during the extending process. The CNS-acid grown SiOx helps the polysilicon passivated contact solar cell to raise the efficiency by ~ 0.15% on average. In summary, the CNS acid has shown the potential for industrial application, which improves not only the manufacturing process but also the device performances.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.