Abstract

The integration of planar valley photonic crystal (VPC) interfaces into high-speed data communication chips markedly improves data rates and system robustness. This Letter presents a novel, to the best of our knowledge, edge coupler, termed the line-defect taper, which is crucial for efficient and broadband light delivery to planar VPC interfaces via silicon strip waveguides. The coupling performance of the line-defect taper is evaluated through full-wave three-dimensional finite-element simulations. The results demonstrate a -3 dB transmission bandwidth of 65.5 nm, covering 41.2% of the topological bandgap, and a -1 dB transmission bandwidth of 16.3 nm, accounting for 10.3%. With its compact design (only 3.6 µm in length), simplicity, and scalability, the line-defect taper is a promising candidate for integration into densely packed chips, highlighting its potential in advancing on-chip devices.

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