Abstract
As a widely adopted candidate in the modern electric industry, much attention has been paid to SnBi solder alloy. However, the intrinsic brittleness of this alloy hinders its further application. To tackle this challenge, a SnBiAgIn solder alloy with lower melting temperature but outstanding mechanical properties was prepared in this work. The ultimate tensile strength and elongation stand at 104.2 MPa and 52.3%, respectively, displaying an exceptional trade-off between strength and ductility as well as a higher creep resistance. The addition of Ag facilitates the formation of intermetallic compounds (IMCs) and refinement of solidification structure while the alloying of In induces the solid solution softening effect, which can enhance the strength and ductility simultaneously. Compared with SnBi eutectic solder alloy, dislocation climb and glide become the dominant creep mechanism. The IMCs distributed in the SnBiAgIn solder alloy matrix can act as the obstacles to hinder the movement of dislocations and subsequently produce higher creep resistance.
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