Abstract
SiC is a well known wide band gap semiconductor explored for realizing the piezoresistive micro-electro-mechanical systems (MEMS) pressure sensors for harsh environments. In this work a thin SiC diaphragm based piezoresistive pressure sensor was designed by locating the resistors of different SiC polytypes such as 3C, 4H, and 6H-SiC, on highly stressed zone of the diaphragm and analyzed. The sensor design parameters were extensively studied by executing the finite element method (FEM) and piezoresistive simulation using device simulation software. The sensor characteristics were measured for different SiC polytypes and compared for different design parameter variations to obtain the optimum sensor performance under the influence of the pressure upto 8 MPa. Influence of temperature for heavily doped SiC polytypes is also studied. The simulation results shows that the pressure sensor with 3C-SiC polytype offers higher sensitivity 7.3 μV/V/KPa as compared to 4H-SiC and 6H-SiC polytypes.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
