Abstract
A SiGe HBT power amplifier for Time Division Synchronous Code-Division Multiple-Access (TD-SCDMA) application with a single positive 3.3V supply has been demonstrated in this paper by adopting a newly proposed usage of the bonding wire. Though the emitter bonding wire may decrease the power gain, it can also decrease the effect of the knee voltage, thus increase the efficiency of the power amplifier. The post-simulation result shows that it can exhibit a linear gain of 29dB, output power of 30dBm, power-added efficiency of 38.49%, and -43dBc suppression at the second harmonic for TD-SCDMA application.
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