Abstract
Defective pixels always exist in an uncooled infrared focal plane array (IR FPA), and have a significant impact on image quality. To fundamentally reduce defective pixels and improve IR FPA's reliability, failure analysis (FA) is critically needed. In this work, a self-test (ST) method is proposed to detect the structural failures of uncooled IR FPA. Based on the lumped thermal parameters of a pixel, a structural failures model is presented, and an electrical circuit is designed. The insufficient released, normal released, over released and contaminated IR FPAs are measured. The measured results show that their lumped thermal parameters have a clear differentiation, which not only experimentally verifies the validity of this method, but also shows that it is an effective method for nondestructive analysis of structural failures.
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