Abstract
The middle of the last century is particularly important to science and technology. It is during this time Bell labs invented the working of transistor and paved the way for all future innovations that is seen today – starting from transistor radio to ultra-powerful and sleek smart phones. All this development happened at a remarkably fast pace. The first IC in 1949 only held 5 transistor in it, while as of 2012, the typical IC chip measures about 10-400 square millimeter, with up to 9 million transistor/mm2. To make things even better VLSI is being replaced with Ultra-light Scale Integrations (ULSI), Wafer Scale Integration (WSI), System-on-a-chip (SoC) and 3- diemensional Integrated Circuits (3D-IC). Unlike a normal IC we are familiar with, a 3D-IC would have several layers of electronic components integrated both vertically and horizontally extending Moore’s law to a new limit.
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