Abstract
This project focused on developing a micro-scale counter flow heat exchangers for Joule-Thomson cooling with the potential for both chip and wafer scale integration. This project is differentiated from previous work by focusing on planar, thin film micromachining instead of bulk materials. A process will be developed for fabricating all the devices mentioned above, allowing for highly integrated micro heat exchangers. The use of thin film dielectrics provides thermal isolation, increasing efficiency of the coolers compared to designs based on bulk materials, and it will allow for wafer-scale fabrication and integration. The process is intended to implement a CFHX as part of a Joule-Thomson cooling system for applications with heat loads less than 1mW. This report presents simulation results and investigation of a fabrication process for such devices.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
