Abstract
System-in-Package (SiP) is a cutting-edge packaging technique that is flourishing in the semiconductor sector. Physical testing, which can be time-consuming and lead to design modification iterations delaying product release or delivery, has traditionally been used to assess the reliability of SiPs. Simulation methods that mimic physical tests can be used to shorten product development cycles, increase reliability, and lower development costs. This paper introduces a SiP reliability assessment methodology based on virtual qualification. A life prediction methodology of SiP based on physics-of-failure (PoF) is studied in conjunction with multi-source fusion life information of typical structures. Based on this, a comprehensive reliability assessment methodology of SiP is formed. The information input includes material types, structure size, and environmental load conditions. The finite element analysis (FEA) is used to analyze the typical structures. The life distribution of SiP components is obtained through the theory of the cumulative damage and competitive failure model. Through multi-source information fusion, the SiP comprehensive reliability assessment methodology is determined. Finally, a case study is done to determine the accuracy of the approach.
Published Version
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