Abstract
The design of a simple pulse-type evaporator ensuring a high rate (up to ∼104 nm/s) of deposition of thin films (0.01–100 nm thick) onto a solid surface in ultrahigh vacuum is described. The evaporation pulse is created by discharge of a capacitor bank via a fast-response evaporator produced from a tungsten foil. Results illustrating the efficiency of this device are presented.
Full Text 
Sign-in/Register to access full text options
Sign-in/Register to access full text options 
Paper version not known
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
