Abstract
This paper summarizes the results of a program to construct an internal variable viscoplastic damage model to characterize 95.5Sn–3.9Ag–0.6Cu (wt.%) lead-free solder under cyclic thermomechanical loading conditions. A unified model is enhanced to account for a deteriorating microstructure through the use of an isotropic damage evolution equation. Model predictions versus experimental data are given for constant strain-rate tests that were conducted at strain rates of 4.2×10−5s−1 and 8.3×10−4s−1 over a temperature range from −25°Cto160°C; cyclic shear tests; and elevated-temperature creep tests. A description is given of how this work supports larger ongoing efforts to develop a predictive capability in materials aging and reliability, and solder interconnect reliability.
Published Version
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