Abstract
The feasibility of using a novel metallorganic chemical vapor deposition (MOCVD) technique to achieve the deposition of a thin and conformal copper film was examined. The deposition procedure consisted of two consecutive steps: an oxide deposition step followed by a reduction step. Copper(II)-1,1,1,5,5,5-hexafluoro-acetylacetonate hydrate was used as the copper precursor and water as the additive. The preformed copper oxide thin film was reduced to an elemental copper metal film through exposure to ethyl alcohol. The proposed two-step MOCVD method was found to succeed in forming smooth and continuous thin copper films.
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