Abstract
With the advancement of new technologies, the reductions of size are more in recent electronic devices, which lead to an increase in heat dissipation. Thus, the problem of electronic cooling has become a critical issue in this area. This work is based on the experimental and optimization analysis. The results from the experimental analysis are compared for different shaped heat sinks like concave and congruent made up of copper and aluminium respectively. The experiment is conducted for different heat input and the performance of the heat sink is observed. Results shows that the heat transfer coefficient is more and thermal resistance is less with concave shaped heat sink and this study on experimental performance of different shaped heat sink manifests its application in electronic devices.
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