Experimental Investigation of Heat Transfer Enhancement in a Finned U-Shaped Heat Pipe of CPU Cooling System Using Different Fluids

Abstract

This paper experimentally studies the heat absorption performance of a heat sink with vertical embedded heat pipes in the aluminum blade. The cooling system with embedded heat pipes distributes heat from the CPU to both the base plate and the heat pipes, and then transfer heat from fins to the Environment. The thermal resistance and heat transfer coefficient are evaluated for natural convection under steady-state condition, by changing the heat input from 25W to 100 W. the heat pipe is filled distilled water, Ethylene Glycol, Ethanol, Ethylene glycol distilled water solution, copper oxide/ water Nano-fluid (Cu/H2O) with different weight percentage. The results indicate that the presence of copper oxide/ water Nano-fluid in heat pipe increase heat transfer in a computer CPU cooling system and reduce the thermal resistance of the pipe rather than other fluids. In fact, the use of nanofluids removes heat transfer significantly in CPU cooling systems and can be a good replacement for the common working fluid in this device.