A novel water-in-deep eutectic solvent microemulsions for chemical polishing of single crystal KDP

Abstract

Microemulsion (ME) has been investigated as a chemical polishing (CP) fluid for effective polishing of single crystal potassium dihydrogen phosphate (KDP), perfectly avoiding the generation of mechanical stress. In this work, a water-in-deep eutectic solvent ME was proposed as the polishing fluid for CP of single crystal KDP. Deep eutectic solvent (DES) is formulated using n-octanol as hydrogen bond donor and methyltrioctylammonium chloride (MTOAC) as hydrogen bond acceptor, with a mass ratio of 2:1. The ME was prepared by mixing DES as the oil phase (12.5 %, wt.), a hydrochloric acid solution as the water phase (12.5 %, wt.), and isopropanol as the cosolvent (75 %, wt.), without adding any other surfactants. The properties of the ME were characterized by conductivity measurements and ultraviolet (UV) spectroscopy. The reactivity of ME with KDP was measured by the conductivity method, and it was higher at low pH values. A hydrochloric acid solution with a pH of 3 was selected as aqueous phase, considering its effects on particle size, salt loading, and static etching rate. The water content affects the polarity of ME and the final water content was determined to be 12.5 % to ensure high polarity of ME. The surface quality of the KDP crystals before and after polishing was examined using grazing incidence X-ray diffraction (GIXRD) analysis. The average roughness of the KDP crystal surface was decreased from 1.96 nm to 1.43 nm, and the root-mean-square (RMS) roughness was reduced from 2.81 nm to 1.86 nm, demonstrating a significant polishing effect. Finally, the polishing mechanism was elucidated in terms of the irreversible chemical reaction between the active components in the microemulsion and the KDP crystals.