Abstract
In this work, a thermal conductive Ag2O paste was prepared for enhancing the heat dissipation capability of light-emitting diode (LED) packaging structure. Ag2O paste was thermally reduced to Ag layer with the high thermal conductivity of 139.8 W/(m·K) after sintering at 250 °C, giving rise to boost the thermal management of LED. The LED packaged by Ag2O paste displays the low thermal resistance of 7.04 K/W and the low junction temperature change of 5.49 °C, which is significantly lower than that of the traditional Sn-based solder. The experimental results demonstrated that the inexpensive Ag2O paste had the potential to satisfy the heat dissipation requirements of LED.
Published Version
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