A novel temperature-strain synchronous measurement method

Abstract

Thermal-mechanical coupling deformation is inevitable in the operation of materials and structures. Traditional deformation researches have mainly focused on temperature or deformation measurement at a specific temperature, but few studies have investigated the coupling relationship between temperature and deformation in a non-uniform thermal environment. This study presents a novel method of measuring the temperature and strain distribution of an object synchronously. A calibration object and its calibration method were designed to be utilized in the synchronous calibration of both the infrared and visible cameras, and a matching method of the infrared image and the visible image was proposed. The data in the non-uniform temperature field and the non-uniform strain field corresponded accurately using the proposed method. A simulation experiment and actual thermal coupling deformation experiments were utilized to verify the effectiveness and accuracy of the proposed method. The proposed method can realize the accurate correspondence of the temperature and strain fields in the measurement area and provide technical support for studying the actual thermal-mechanical coupling deformation of materials and structures.