Abstract
A novel silicon-on-insulator (SOI) high-voltage device of super-junction (SJ) lateral-double-diffused metal-oxide-semiconductor transistors (LDMOSTs) with T-dual dielectric buried layers (T-DBLs) is presented. The T-DBLs are formed by the first T-shaped dielectric layer and the second dielectric layer. A lot of holes are accumulated on the top interface of the second dielectric layer, which compensates for the charge imbalance of the surface N and P pillars, thus the substrate-assisted depletion (SAD) effect is eliminated in the new device. The electric field of the second dielectric buried layer, E12, is enhanced by the interface charges, and the breakdown voltage Vbreakdown is increased. E12 = 515 V/μm is obtained in the T-DBL SOI SJ. The Vbreakdown of the new device is increased from 124 V of the conventional SOI SJ to 302 V with a 15 μm length drift region. The specific on-resistance (Ron,sp) of the T-DBL SOI SJ is only 0.00865 Ω·cm2 and the FOM (FOM = V2breakdown/Ron,sp) is 10.54 MW/cm2.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.