Abstract

Based on the continuity theorem of electric displacement including interface charges, the enhanced dielectric layer field (ENDIF) for silicon-on-insulator (SOI) high-voltage devices is proposed. The following three approaches for enhancing the dielectric layer electric field E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</sub> to increase the vertical breakdown voltage of a device V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">B,V</sub> are presented: 1) using a thin silicon layer with a high critical electric field E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">S,C</sub> ; 2) introducing a low-permittivity dielectric buried layer; and 3) implementing interface charges between the silicon and the dielectric layer. Considering the threshold energy of silicon epsiv <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> , the formula of E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">S,C</sub> on silicon layer thickness t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">S</sub> is first obtained, which increases sharply with a decrease of t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">S</sub> , and reaches up to 141 V/mum at t <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">S</sub> = 0.1 mum. Expressions for E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</sub> and VByV are given, which agree well with simulative and experimental results. Based on the ENDIF, the new device structures are given, and an E <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">I</sub> value of 300 V/mum has been experimentally obtained for double-sided trench SOI. Moreover, several conventional SOI devices are explained well by ENDIF.

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