Abstract
An integrated multifunction micro-sensor for three-dimensional micro-force precision measurement under different pressure and temperature conditions is introduced in this paper. The integrated sensor consists of three kinds of sensors: a three-dimensional micro-force sensor, an absolute pressure sensor and a temperature sensor. The integrated multifunction micro-sensor is fabricated on silicon wafers by micromachining technology. Different doping doses of boron ion, placement and structure of resistors are tested for the force sensor, pressure sensor and temperature sensor to minimize the cross interference and optimize the properties. A glass optical fiber, with a ladder structure and sharp tip etched by buffer oxide etch solution, is glued on the micro-force sensor chip as the tactile probe. Experimental results show that the minimum force that can be detected by the force sensor is 300 nN; the lateral sensitivity of the force sensor is 0.4582 mV/μN; the probe length is linearly proportional to sensitivity of the micro-force sensor in lateral; the sensitivity of the pressure sensor is 0.11 mv/KPa; the sensitivity of the temperature sensor is 5.836 × 10−3 KΩ/°C. Thus it is a cost-effective method to fabricate integrated multifunction micro-sensors with different measurement ranges that could be used in many fields.
Highlights
Three-dimensional (3D) micro-force measurementa are an essential part in many engineering and science applications, such as precision 3D profile measurement [1], determining of material elastic modulus and hardness of materials [2], micromanipulation of micro objects [3,4] and monitoring of insect behavior [5]
Some methods are employed to minimize interference of the temperature sensor resulting from the applied pressure: high boron ion doping concentration 2 × 1020 cm3, with low piezoresitive coefficient, is selected to form the thermistors; the thermistors are located at the surface of silicon wafer above the silicon-glass bonding area where the strain resulting from the applied pressure is small; the thermistors are designed as wave type structures arranged along the [100] and [010] crystal directions, shown in Figure 1, which achieves the minimum piezoresistive coefficient of the (100) silicon
The temperature sensor is measured in a temperature controller in the range of 30 °C–150 °C and experiment process is repeated for six times
Summary
Three-dimensional (3D) micro-force measurementa are an essential part in many engineering and science applications, such as precision 3D profile measurement [1], determining of material elastic modulus and hardness of materials [2], micromanipulation of micro objects [3,4] and monitoring of insect behavior [5]. Fabrication of the curled micro-cantilever beams is quite complicated due to the combination of elastomer, polymer, Pt, Ti, and silicon, which is simplified in this work by only using silicon Among these force sensors, the piezoresistive probe sensors, fabricated on monocrystalline silicon, are the most popular type [11,12,13,14] due to their excellent performance, simple fabrication process and low cost. At elevated temperatures, the mechanical properties of the polymer matrix deteriorate rapidly compared to normal temperature [16]; the elastic deformation of embryonic cell, applied by high pressure, is obviously compared to low pressure [17] To solve these problems, this paper develops a novel integrated multifunction silicon micro-sensor. Thereby information can be obtained at different pressures and temperatures and be more accurate
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