Abstract
A novel, media-isolated, temperature-compensated, bulk-micromachined integrated absolute pressure sensor has successfully been developed. The sensor is usable for most applications involving exposure to harsh media, such as fuel vapor seen by manifold absolute pressure (MAP) sensors. The device consists of two dice bonded together. Devices are batch fabricated by bonding two wafers together prior to sawing. The bottom wafer contains bulk-micromachined piezoresistive pressure sensors and the top wafer contains signal-conditioning integrated circuitry. The pressure sensors and the integrated circuits are coupled together by wirebonding from the top die down to the bottom die through via holes anisotropically etched in the top wafer. Characterization of the device indicates that the devices fabricated meet the specifications of a MAP sensor.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
