Abstract
AbstractA novel compact interembedded artificial magnetic conductor (IE‐AMC) structure is introduced in this paper. For a desired bandgap frequency, the cell size of this novel IE‐AMC structure is only 30% to 40% of the conventional Sienvenpiper structure with the same substrate used. The IE‐AMC structure is very suitable to microwave integrated circuits and antenna‐arrays applications, especially in wireless‐communication bands (GSM, PCS, and ISM). © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 45: 303–305, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20803
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