A novel approach of fatigue testing and evaluation of electronic systems based on phase tracking

Abstract

This paper presents an experimental approach to perform fatigue testing of a lightly damped electronic assembly subjected to harmonic excitation. By leveraging the power of the phase locked loop control algorithm, our proposed work aims to accurately track the phase of the system. This innovative approach enables precise measurement of the drop in resonant frequency due to fatigue, enhancing overall damage prediction. The proposed approach exploits the characteristics of the materials that the phase at the resonance is constant and for a lightly damped system, the value is close to pi/2. In the event that the test article experiences fatigue, and the resonant frequency undergoes a change, the controller will promptly adapt to the new frequency while upholding a constant phase, ensuring the uninterrupted continuity of the testing process. The proposed approach is demonstrated by using the Ball Grid Array (BGA) electronic package as an example, where the test setup, data acquisition, and data monitoring for identifying the interconnect failure are presented. Failure analysis of the test article shows that the primary failure mode is the solder joint failure at the Intermetallic (IMC) layer. A finite element model is developed and correlated with experimental modal analysis to accurately estimate maximum stress and deflection in solder joints. By utilizing the obtained results, one can create a more accurate SN curve for the tested material. This will allow for a better understanding of the material's fatigue behavior and enable more precise predictions of its durability in real-world applications.