Abstract
Self-assembling process has been wildly used in the metal protection, and the better approaches to improve the assembled film are always explored. In this paper, a novel click-assembled approach triggered by UV light on copper surface is present. The results show the thiol-yne click reaction between dithiothreitol (DTT) and tert-butyl acetylene (TBA) is triggered on copper surface under the exposure of 365 nm UV light. The newly generated C–S bonds connect the inhibitor molecules on copper surface to form the thioether (TTA) film, the protective efficiency is 96.0%. This assembled approach triggered by light provides a new idea for the metal protection.
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