Abstract
AbstractA novel amide and imide copolymer, poly(N‐phenylmethacrylamide‐co‐N‐(p‐hydroxyphenyl)maleimide) was synthesized for the matrix resin of ultraviolet (UV) photoresist. Elemental analysis and self‐polymerization experiment verified that this copolymer was very close to 1:1 (molar ratio) in composition and was predominately alternating. It was able to dissolve in various organic solvents and form uniform curing film when spin‐coating. Its differential scanning calorimetry and thermogravimetry analysis test showed good thermal stability and its glass transition temperature (Tg) was about 280°C. Photolithographic experiment indicated that the UV photoresist formulated with this copolymer as matrix resin was achieved the resolution of about 5 μm, the contrast of 3.001, and the sensitivity of 32 mJ/cm2. With good plasma etching resistance, the photoresist studied was able to bear 250°C for 30 min without thermal deformation during the thermal resistance test. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers
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