A novel adaptive deep transfer learning method towards thermal error modeling of electric spindles under variable conditions

Abstract

Thermal error modeling (TEM) plays a vital role in maintaining the machining accuracy of electric spindles. Recently, deep learning (DL) techniques have obtained promising achievements in this area. However, DL techniques have certain limitations. The data acquired from variable working conditions present large distribution discrepancies, the DL-based model established on one working condition fails to obtain satisfactory prediction accuracy in another working condition. Moreover, existing studies focus solely on using temperature features to build prediction models, neglecting the full use of multi-sensory information. To address these issues, this paper proposes a novel adaptive deep transfer learning method towards TEM of electric spindles, which takes full advantage of the temperature, current, and power sensory information. Firstly, finite element simulation is employed to analyze the thermal characteristics of the electric spindle and determine the locations for temperature measurement points. Then, the convolutional long short-term memory network (C-LSTMN) is constructed, where the spatial features from multi-sensory information between inputs and prediction patterns are captured by convolutional layers, these features are further processed by long short-term memory network (LSTMN) to extract temporal features. Subsequently, the multi-kernel joint maximum mean discrepancy (MK-JMMD) measure is developed to minimize the distribution discrepancies between the source and target domains, thus the prediction model initially established on the source domain can be adaptive to effectively predict on the target domain. Finally, with unavailable thermal error data in the target domain, the proposed method is validated through 12 transfer tasks using datasets from four working conditions with other comparison methods. The results demonstrate that the proposed method overcomes the challenges of unavailable labeled thermal error samples and outperforms advanced methods.