A non-local void filling model to describe its dynamics during processing thermoplastic composites

Abstract

A model is developed to describe the void dynamics within thermoplastic composite tape during the tape placement process. The model relates the volatile pressure in voids, the applied compaction load, fiber bed response and the resin pressure due to squeeze-flow of resin from resin-rich regions to fill void regions. This model relies on some geometric simplifications, but incorporates the relevant physical phenomena.This void consolidation model was implemented in a numerical code which predicts the void development during the process. The initial void geometry can be introduced either manually, using a random generation algorithm or from actual processed tape micrographs.The model predicts that the final void content depends on the original void content but also on the initial void distribution. Presented results analyze the influence of void distribution on tape consolidation. Limitations of the consolidation process rate by the resin squeeze flow pressures are clearly demonstrated.