Abstract
AbstractA new two–dimensional process simulator HITOP is developed which can handle oxidation, diffusion, and ion implementation processes. This simulator can be used for process design of practical scaled MOS basic circuits and has the following characteristics: (i) the region of a size from a few μm to a few tens μm containing multiple MOS devices can be simulated simultaneously; (ii) the variation of the layered film formation during the process can be recognized; (iii) a highly accurate simulation is possible from the viewpoint of physical chemistry modeling and of numerical algorithms; (iv) a bidirectional interface with the shape simulator is contained. It is possible to accept the shape of the etching and deposition processes, continue execution, and return the shape data after the process to the shape simulator. For the benefit of the user, changes of the shape of the junction during the process, situation of the growth of the oxide film and the modification of the top layer are displayed successively so that the basic information for circuit design is provided. The present system can be used with a layout processor and a device simulator.
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