Abstract
The electrochemical potential of electroless nickel and electroless cobalt plating baths can be altered by the addition of a variety of chemical compounds to the baths. At the same time, the metal‐to‐phosphorus ratio in the deposit is altered. This behavior has been studied for a series of baths using typical accelerators including thiourea, glycine, and formate; each of these represents a different type of accelerator characteristic. A Tafel‐like behavior was observed to apply for the deposition of nickel (or cobalt) and also for the deposition of phosphorus. Therefore, given a suitable reference point, the plating rate and metal‐to‐phosphorus ratio can be predicted from the measured potential. A model based on a modified hydride mechanism is proposed for the electroless deposition of nickel‐phosphorus. With the help of this model, the hydrogen evolved during deposition can be quantitatively accounted for.
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