Abstract
The ammonia generally used as a buffer in alkaline electroless nickel and cobalt plating baths has been shown to have a significant effect on both the rate of deposition of thin metal films and the magnetic and physical properties of such films. These effects have been studied on both metallic and nonmetallic substrates, using both ammonia and nonammine buffer systems, and attempts have been made to correlate them with spectral and polarographic observations.
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