Abstract
Electromagnetic compatibility (EMC) of integrated circuits (ICs) represents a major constraint for the qualification of electronic circuits. Today, there exist standardized models such as integrated circuit emission model for conducted emissions (ICEM-CE) that allows the prediction of conducted emission generated by an IC at a printed circuit board (PCB) level. However, the EMC levels may change after a certain period of operation due to the aging of components. On the other hand, no existing model or tool can predict the long-term EMC levels. This paper presents a new methodology for modeling of ICs in order to construct an EMC model, which takes into account the aging based on a new reliability model called MultiphySics mulTistressOrs predictive Reliability Model (M-STORM).
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