A new method of determining the slicing parameters for fixed diamond wire saw

Abstract

The fixed diamond wire is widely used to slicing hard and brittle crystal material, such as mono-crystalline silicon, polycrystalline silicon, sapphire, silicon carbide, and so on. The slicing capability of fixed diamond wire should be matched reasonably with the properly slicing parameters to ensure the high slicing quality and slicing efficiency. While, there is a certain degree difference in slicing capability for different fixed diamond wires because of the location distribution, density, size distribution, and the protrusion height for diamond particles are all different. The worse slicing quality and lower slicing efficiency will be got if the slicing parameters is not matched reasonably with the slicing capability of fixed diamond wire. Hence, it is necessary to determine the proper slicing parameters for different fixed diamond wire according to its own characteristics to machining hard material with higher efficiency and quality. In this paper, a new method of determining the proper slicing parameters for fixed diamond wire is established. The wire bow angle is used as an index to describe the rationality of the determination for slicing parameters. The correctness and accuracy of this method are verified by a multi wire saw slicing mono-crystalline silicon ingot experiment. The wire bow angle and normal cutting force are obtained respectively by theoretical and experimental results. It is found that the experimental results of wire bow angle are around 3°, and this shows that this new method of determining processing parameter is feasible. In addition, the theoretical and experimental results of the normal cutting force are compared. These results all indicate that the slicing parameters determined in this paper match well with the slicing performance of the fixed diamond wire used in the experiment.