Abstract
A new LSI interconnection method, the printed wiring connection (PWC) method, has already been developed. This method involves a planar interconnection, formed by screen printing, utilizing a polymeric conductor. Using this new method, an IC card was made, and the feasibility of applying this method to IC card packaging was investigated. The IC card developed has passed most reliability tests based on the ISO standard and several environmental tests to prove its application feasibility.
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