Abstract
A high rate and low temperature sputtering method has been developed to perform the sputtering of a small size iron target. In order to produce a high density plasma, two disk targets of the same size were arranged parallel to each other, and a DC magnetic field up to 1000 Gauss was applied to confine the secondary electrons in the space between the targets. In this system, a high density plasma was produced at the points where the beam-plasma interaction is enhanced; the frequency of the plasma wave becomes equal to that of the high energy secondary electron beam and at magnetic fields above 600 Gauss. Under these conditions, high rate sputtering (current density on the target is above 50 mA/cm/sup 2/) can be realized at a sputtering gas pressure above 1.5 mTorr. A deposition rate about 500 AA/min can be obtained at an input power of 130 W. Film uniformity on the substrate of 10 mm*10 mm was within 15%. >
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
