Abstract
AbstractMultiphysics coupling simulations are of great importance and challenge in engineering and industrial applications. A new efficient full‐wave energy‐conservative projection method between two heterogeneous meshes is proposed in this article, for the analysis of electromagnetic‐thermal‐stress coupling in the printed circuit boards (PCBs) and antenna arrays. The projected variables are directly chosen as the electric fields instead of conventional thermal sources, and a scalable domain decomposition method is used to solve the projection problems. In addition, a bounding‐box algorithm and the spatial K‐dimensional Tree searching algorithm are developed for physical quantity projection between the two heterogeneous meshes. A series of numerical analysis of the electromagnetic‐thermal‐stress coupling process are conducted. In particular, a realistic PCB example is presented, where 144 CPU cores are used and two heterogeneous meshes of over 20 million grids are constructed. A realistic antenna array with 10 000 units is also presented, where 1200 CPU cores are used and two heterogeneous meshes of over 100 million grids are constructed.
Published Version
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