A New Cutting Wire Prepared by Copper-Diamond Composite Electroplating

Abstract

iamond cutting wire, as a new one, could overcome the defects of traditional cutting wire and would have a wide potential application. Electroplating diamond wire was prepared by composite electroplating in this article. The influence of cathodic current density, the diamond content in the electrolyte and other process conditions on the amount of diamond in the composite coating was checked by EDTA titration analysis. Effects of the diamond content in the electrolyte on electrochemical process of copper-diamond composite electro-deposition were investigated by measuring electrochemical polarization curves. With increasing the cathode current density and the diamond content in the electrolyte, the amount of diamond in the composite increased firstly, and reached a maximum, then decreased. The cathode current decreased with the increase of diamond content in the electrolyte. Copper-diamond composite plating process could be explained by Guglielmi two-step adsorption mechanism. The influence of plating parameters on the deposition behaviors of copper–diamond composite coating layers is ascribe to the change of diamond adsorption state on the cathode surface. After heat treatment, the largest wire tensile force is 159.7 N and the tensile strength reaches to 2258.8 MP.