Abstract
A new aramid base material for use in laminates to be applied to advanced surface mount technology was developed. A new fibre based on PPDETA (Poly‐p‐phenylene/3,4'‐diphenylether terephthalamide) was found to have negative thermal and hygroscopic expansion coefficients, low ionic impurities and high affinity to epoxy and polyimide resins. The fibre was processed into fabrics and papers to be used as a base material for printed circuit boards for advanced surface mount technology. Impregnation with a new epoxy resin with high purity and high temperature resistance implemented the development of a new laminate with minimal electromigration and high dimensional stability. Thus, a new laminate was developed to be used for LCCC, PGA, COB, TAB, Flip‐Chips and other advanced surface mount technologies. Reliability of the laminate to electromigration between surface conductors, between plated‐through barrels, and between opposed conductors was found to be one of the highest available today. These types of behaviour were related to the high purity and high temperature resistance of both the reinforcement material and the resin. The short life of through‐hole plating in thermal shock was improved by the application of a new plating technology. Application to multilayer boards and laminates with a low dielectric constant is also being investigated.
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