Abstract
The nested finite element methodology (NFEM) presented in Part I of this series, is used in this paper to analyze the viscoplastic stress-state in a flip-chip-on-board (FCOB) and a chip scale package subjected to temperature cycling loads. The results are validated with conventional finite element method (CFEM). An energy-partitioning (EP) damage model is used to predict cycles to failure, based on the energy densities obtained from NFEM and CFEM, and results are compared with experiments.
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