A multipronged approach to electronic packaging education

Abstract

This paper discusses several recent initiatives taken at the University of Colorado, Boulder to integrate electronic packaging education in the engineering curriculum. A multipronged approach that targets both the student population and industrial professionals is described. Recognizing that the needs of the two communities are different, the educational programs are tailored differently to achieve success. The strategy includes some of the traditional initiatives, and a novel approach to provide advanced education to professionals in industry.