Abstract
In this paper, a multi-circle planar electrical impedance tomography (EIT) sensor is proposed for three-dimensional (3D) miniature imaging. There are two problems in 3D miniature EIT imaging: 1) the spatial resolution is low due to the number of electrodes is limited; 2) contact impedance influences image reconstruction quality severely. The proposed EIT sensor made by a printed circuit board (PCB) adopts multi-circle structure and tackles the two problems. Driven electrodes are distributed on the outermost two circles, while measurement electrodes are distributed on the innermost circle. Contact impedance is reduced due to the area of driven electrodes could be larger than traditional ones by using the multi-circle structure, it’s also owning to gold is deposited on the surface of the electrodes. Moreover, a new driven-measurement pattern of the EIT sensor is proposed to improve the spatial resolution as well as image reconstruction quality. The proposed EIT sensor is verified by both simulation and experiment. Average Image correlation coefficient (ICC) is as high as 0.8475 in simulation. Compared with the 16-electrode EIT sensor, ICC is improved 39.16%. In experiment, average ICC of four standard objects is 0.8389. The proposed 3D EIT sensor is good at miniature imaging.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call