Abstract
The mechanism of oxidation-induced stacking fault (OSF) formation in Czochralski silicon (CZ-Si) crystals was investigated by transmission electron microscopy observations of the initial stages of OSF growth. OSFs were observed to be always generated at one of the <110> edges of platelet oxygen precipitates. We observed previously that these platelet oxygen precititates had an expansive strain field in the direction parallel to the precipitate plate and a compressive strain field normal to the plate. Silicon self-interstitials having compressive strain are probably attracted to the expansive strain field of the precipitates, and condense to form stacking faults. A new model for OSF generation is presented taking into consideration the strain field around self-interstitials and oxygen precipitates.
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