Abstract
A miniaturized Ka-band bandpass filter (BPF) is presented by using monolithic microwave integrated circuit (MMIC) technology in this brief. Aiming at low cost and high integration, small die area of MMIC BPFs is significantly required for RF front-end modules.However, the filtering performance of BPFs is negatively correlated to its miniaturization. To this end, the folded hybrid resonator is investigated in this brief, which is composed of a quasi-lumped capacitor and a distributed microstrip line. To realize miniaturization, two metal layers of GaAs process are fully utilized. For low loss, the distributed inductor is designed on the top thick layer, while the quasi-lumped capacitor is on the lower metal layer of high sheet resistance. To reduce the unwanted mutual coupling between adjacent quasi-lumped capacitors, shielding structures are added into BPFs, resulting in a 5-dB and 12-dB enhancement to the lower and upper stopbands, respectively. Based on the mixed electric-magnetic coupling topology, a second-order MMIC bandpass filter is designed and fabricated by using GaAs process. Small die area, low loss, high selectivity, and wide stopband are simultaneously obtained, indicating a promising application of the proposed miniaturized MMIC bandpass filters.
Published Version
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