A micro-packaged image acquisition and processing module

Abstract

The paper describes a prototype module, which is an image acquisition and processing pipeline implemented in a micro-package. The module converts incident light directly to processed digital video data. The system is packaged using a novel three-dimensional technology called MCM-V (multichip module-vertical), Val (1991). This technology stacks integrated circuits in the z-axis to produce dense systems. The module is fully programmable and can be used in a wide range of image processing tasks. The results presented form the first stage in the development of high performance ultra-miniature camera and image processing systems.