A Method of Chemical-Mechanical Polishing of a Thick Silver Layer on Patterned Silicon Wafer

Abstract

Microfluidics-based biochips for biochemical analysis are receiving much attention nowadays. These composite microsystems, also known as lab-on-a-chip or bio-MEMS, offer a number of advantages over conventional laboratory procedures. They automate highly repetitive laboratory tasks by replacing cumbersome equipment with miniaturized and integrated systems, and they enable the handling of small amounts, e.g., micro- and nano-liters, of fluids. Thus they are able to provide ultra-sensitive detection at significantly lower costs per assay than traditional methods, and in a significantly smaller amount of laboratory space. Advances in microfluidics technology offer exciting possibilities in the realm of enzymatic analysis (e.g., glucose and lactate assays), DNA analysis (e.g., PCR and nucleic acid sequence analysis), proteomic analysis involving proteins and peptides, immuno-assays, and toxicity monitoring.Biochips can be used to detect molecules and/or sequence nucleic acid molecules with aid of an array of electrochemical detector cells containing one or more electrodes per cell where each cell being electrically isolated at a wafer level. For many applications it is beneficial to form a non-planar working electrode using a metal which will corrode during CMP steps.We’ve developed a novel Ag and Cu integration process which a) solves problems of metal corrosion over 3D topography during CMP step and b) prevents metal surface contamination with CMP residual slurry and polishing byproducts not usually removable by brush or megasonic cleaning.Electrochemical studies show corrosion behavior of thick Ag layers in different CMP slurries used in this process. SEM images of cross-sectioned metal lined electrochemical cells (vias) clearly demonstrate advantages of new process (right) without traces of corrosion vs conventional CMP process (left).This process can be used also for polishing of other metals and dielectrics over topography where aggressive cleaning post-CMP steps are not desirable. Figure 1