Abstract
This paper presents an electromagnetic MEMS disk gyroscope based on fused silica to enhance the accuracy of MEMS gyros under high overload conditions. A laser-induced modified wet etching (LIE) technology was utilized for gyro fabrication and a detailed analysis was conducted on the factors affecting quality factor (Q-value) of the gyro. The LIE process parameters were optimized using a four-factor and three-level orthogonal experiment, and structure compensation were implemented to address machining errors. Impact capability of the resonator and mode characterization as well as Q-value of the gyro revealing that the resonator can withstand high overload up to 15000g, frequency of working mode is 15382.2Hz and 15379.8Hz, respectively, which close to simulated result of 15443Hz exhibited high process precision. The corresponding Q-values of the driving mode and sensing mode are 817k and 819k, respectively, indicating high-performance potential.
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