A matched expansion probe card for high temperature LSI testing

Abstract

This paper describes the fabrication process and mechanical properties of a novel probe card were described. To match the thermal expansion between the probe card and a silicon wafer in wafer-level burn-in test, a Pyrex glass substrate with feedthrough connections was used to support the probes. To make the slantwise probe contactors, spray coating was used to form a uniform photoresist film on a deeply-wet-etched silicon wafer. The fabricated probe card has 13185 p/sup +/ silicon probe contactors at a pitch of 150 /spl mu/m on an area of 44.0 mm /spl times/ 45.7 mm. The rigidity of the probes is approximately 91.45 N/m. The planarity of the probe tips is within /spl plusmn/ 1 /spl mu/m from the base level.